In situ imaging of microstructure formation in electronic interconnections
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/srep40010.pdf
Reference39 articles.
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5. Huang, M. L. & Yang, F. Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate. Scientific Reports 4, 7117, doi: 10.1038/srep07117 (2014).
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