In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface-Reference-Cited by-同舟云学术

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In-situ observations of CU₆Sn₅ mophological changes at the liquid SAC305/ solid OSP-Cu interface

Published:2024-04-17 Issue: Volume: Page:215-216
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Nogita Kazuhiro¹,Tan Xin F.¹,Somidin Flora²,McDonald Stuart D.¹,Maeno Hiroshi³,Matsumura Syo¹

Affiliation:

1. School of Mechanical and Mining Engineering, The University of Queensland,Australia

2. Universiti Malaysia Perlis (UniMAP),Center of Excellence Geopolymer & Green Technology (CEGeoGTech), Faculty of Chemical Engineering Technology,Arau,Perlis,Malaysia

3. Kyushu University,The Ultramicroscopy Research Center,Fukuoka,Japan,819-0395

Funder

University of Queensland (UQ)

Australian Research Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535651.pdf?arnumber=10535651

Reference2 articles.

1. In situ imaging of microstructure formation in electronic interconnections

2. In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

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