Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/srep34779.pdf
Reference24 articles.
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5. Zheng, B. C., Meng, D., Che, H. L. & Lei, M. K. On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments. Journal of Applied Physics 117, 203302 (2015).
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