Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics-Reference-Cited by-同舟云学术

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Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics

Published:2014-06-11 Issue:26 Volume:25 Page:265601
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Joo Sung-Jun,Hwang Hyun-Jun,Kim Hak-Sung

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/25/i=26/a=265601/pdf

Reference27 articles.

1. Inkjet printed electronics using copper nanoparticle ink

2. Reactive Silver Inks for Patterning High-Conductivity Features at Mild Temperatures

3. Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

4. Conductive copper and nickel lines via reactive inkjet printing

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2. Room temperature compressed air-stable conductive copper films for flexible electronics;npj Flexible Electronics;2024-07-27

3. Recent progress and opportunities in 2D-material quantum dots: synthesis, doping, characterization, and applications;Physica Scripta;2024-06-25

4. Correlation between morphology and hardness of electrolytically produced copper thin films;Journal of Solid State Electrochemistry;2024-06-05

5. A review of inorganic particles synthesized through electrical discharge in different dielectric media: from devices, structures and components to applications;Frontiers of Materials Science;2024-06

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