Correlation between morphology and hardness of electrolytically produced copper thin films
Author:
Funder
Ministarstvo Prosvete, Nauke i Tehnološkog Razvoja
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10008-024-05948-w.pdf
Reference67 articles.
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3. Wei C, Wu G, Yang S, Liu Q (2016) Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation. Sci Rep 6:34779. https://doi.org/10.1038/srep34779
4. Gu CD, You YH, Wang HL, Tu YP (2012) Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine. Surf Coat Technol 209:117–123. https://doi.org/10.1016/j.surfcoat.2012.08.047
5. Joo SJ, Hwang HJ, Kim HS (2014) Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics. Nanotechnol 25:265601. https://doi.org/10.1088/0957-4484/25/26/265601
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