Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering-Reference-Cited by-同舟云学术

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Published:2013-08-20 Issue:35 Volume:29 Page:11192-11197
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Araki Teppei¹,Sugahara Tohru²,Jiu Jinting²,Nagao Shijo²,Nogi Masaya²,Koga Hirotaka²,Uchida Hiroshi³,Shinozaki Kenji³,Suganuma Katsuaki²

Affiliation:

1. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan

2. Department of Advanced Interconnection Materials, Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan

3. Institute for Polymers and Chemicals Business Development Center, Showa Denko K. K., 5-1 Yawata Kaigan Dori, Ichihara, Chiba 290-0067, Japan

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la402026r

Reference25 articles.

1. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

2. Organic integrated circuits using room-temperature sintered silver nanoparticles as printed electrodes

3. Fabrication of silver nanowire transparent electrodes at room temperature

4. Reliability of ICA attachment of SMDs on inkjet-printed substrates

5. Progress Toward Development of All-Printed RFID Tags: Materials, Processes, and Devices

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