Reliability of ICA attachment of SMDs on inkjet-printed substrates-Reference-Cited by-同舟云学术

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Published:2012-11 Issue:11 Volume:52 Page:2709-2715
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Niittynen Juha,Kiilunen Janne,Putaala Jussi,Pekkanen Ville,Mäntysalo Matti,Jantunen Heli,Lupo Donald

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Molesa S. Ultra-low-cost printed electronics. Ph.D. thesis. University of California at Berkeley; 2006.

2. Functional fluid jetting performance optimization;Pekkanen;Microelectron Reliab,2010

3. Inkjet printing – process and its application;Singh;Adv Mater,2010

4. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials;Perelaer;J Mater Chem,2010

5. Printable electronics: flexibility for the future;Leenen;Phys Status Solidi A,2009

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