The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-019-44758-3.pdf
Reference52 articles.
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2. Tay, S. L., Haseeb, A. S. M. A., Johan, M. R., Munroe, P. R. & Quadir, M. Z. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate. Intermetallics 33, 8–15 (2013).
3. Yang, M., Li, M. & Wang, C. Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering. Intermetallics 25, 86–94 (2012).
4. Chen, G., Wu, F., Liu, C., Silberschmidt, V. V. & Chan, Y. C. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds 656, 500–509 (2016).
5. Kanlayasiri, K., Mongkolwongrojn, M. & Ariga, T. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy. Journal of Alloys and Compounds 485, 225–230 (2009).
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