Multi-scale, Correlative Investigation of Thermo-mechanical Fatigue in SAC Solder Balls-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Multi-scale, Correlative Investigation of Thermo-mechanical Fatigue in SAC Solder Balls

Published:2024-07 Issue:Supplement_1 Volume:30 Page:
ISSN:1431-9276
Container-title:Microscopy and Microanalysis
language:en
Short-container-title:

Author:

Cui Charlotte¹,Flachberger Wolfgang¹,Tkadletz Michael²,Sartory Bernhard¹,Sinojiya Rahulkumar¹,Chamasemani Fereshteh Falah¹,Paulachan Priya¹,Reisinger Michael³,Scheiber Daniel¹,Brunner Roland¹

Affiliation:

1. Materials Center Leoben Forschung GmbH , Leoben , Austria

2. Department of Materials Science , Montanuniversität Leoben, Leoben , Austria

3. Kompetenzzentrum für Automobil-und Industrieelektronik GmbH , Villach , Austria

Publisher

Oxford University Press (OUP)

Link

https://academic.oup.com/mam/article-pdf/30/Supplement_1/ozae044.106/58672616/ozae044.106.pdf

Reference7 articles.

1. Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

2. The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

3. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)

4. The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP