Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C-Reference-Cited by-同舟云学术

Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

Published:2007-01-31 Issue:2 Volume:36 Page:173-178
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Korhonen Tia-Marje K.,Lehman Lawrence P.,Korhonen Matt A.,Henderson Donald W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0048-6.pdf

Reference13 articles.

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2. D.W. Henderson et al. J. Mater. Res. 14, 1508 (2004)

3. S.K. Kang, P.A. Lauro, D.-V. Shih, D.W. Henderson, J.J. Puttlitz, IBM J. Res. Development 49, 507 (2005)

4. T.T. Mattila, T. Laurila, and J.K. Kivilahti, in Micro- and Optoelectronics Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, eds. E. Suhir, C.P. Wong, and Y.C. Lee (Kluwer Academic Publishers, 2006), in press

5. C. Andersson, Z. Lai, J. Liu, H. Jiang, Y. Yu, Mater. Sci. Eng. A 394, 20 (2005)

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