Comparison of Metal Adhesion Layers for Au Films in Thermoplasmonic Applications-Reference-Cited by-同舟云学术

Comparison of Metal Adhesion Layers for Au Films in Thermoplasmonic Applications

Published:2020-02-25 Issue:11 Volume:12 Page:13503-13509
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Abbott William M.¹^ORCID,Murray Christopher P.¹^ORCID,Ní Lochlainn Sorcha¹,Bello Frank¹^ORCID,Zhong Chuan¹,Smith Christopher¹,McCarthy Eoin K.²,Downing Clive²,Daly Dermot²,Petford-Long Amanda K.³⁴,McGuinness Cormac¹,Chunin Igor Igorovich¹,Donegan John F.¹^ORCID,McCloskey David¹

Affiliation:

1. School of Physics, CRANN and AMBER, Trinity College Dublin, Dublin 2, Ireland

2. Advanced Microscopy Laboratory & AMBER, Trinity College Dublin, Dublin 2, Ireland

3. Material Science Division. Argonne National Laboratory, Lemont, Illinois 60439, United States

4. Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States

Funder

Basic Energy Sciences

Science Foundation Ireland

ASRC

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b22279

Reference14 articles.

1. Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films

2. Solid state dewetting of thin plasmonic films under focused cw-laser irradiation

3. Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative

4. High-Quality Ultrathin Gold Layers with an APTMS Adhesion for Optimal Performance of Surface Plasmon Polariton-Based Devices

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4. Ni Drastically Modifies the Microstructure and Electrochemistry of Thin Ti and Cr Layers;The Journal of Physical Chemistry C;2024-01-16

5. Enhancing electrocatalytic activity in metallic thin films through surface segregation of carbon;Physical Chemistry Chemical Physics;2024