Influence of Ti and Cr Adhesion Layers on Ultrathin Au Films
Author:
Affiliation:
1. DTU Danchip/Cen, Technical University of Denmark, Ørsteds Plads, Building 347, 2800 Kgs. Lyngby, Denmark
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.7b10136
Reference42 articles.
1. Self-Supported Metallic Nanopore Arrays with Highly Oriented Nanoporous Structures as Ideally Nanostructured Electrodes for Supercapacitor Applications
2. Stochastic sensing of proteins with receptor-modified solid-state nanopores
3. Electron Scattering and Electrical Conductance in Polycrystalline Metallic Films and Wires: Impact of Grain Boundary Scattering Related to Melting Point
4. Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
5. Influence of grain boundary scattering on the electrical and thermal conductivities of polycrystalline gold nanofilms
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