Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative-Reference-Cited by-同舟云学术

Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Nondamping Alternative

Published:2012-06-05 Issue:6 Volume:6 Page:5702-5709
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Habteyes Terefe G.¹²,Dhuey Scott¹²,Wood Erin¹²,Gargas Daniel¹²,Cabrini Stefano¹²,Schuck P. James¹²,Alivisatos A. Paul¹²,Leone Stephen R.¹²

Affiliation:

1. Departments of Chemistry and ∥Physics, University of California, Berkeley, California 94720, United States,

2. Chemical Sciences Division, §Molecular Foundry, and ⊥Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/nn301885u

Reference32 articles.

1. Optical Properties of Metal Clusters

2. Damping of the localized surface plasmon polariton resonance of gold nanoparticles

3. Radiation Damping in Surface-Enhanced Raman Scattering

4. Drastic Reduction of Plasmon Damping in Gold Nanorods

5. Influence of interband electronic transitions on the optical absorption in metallic nanoparticles

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