Nanostructure- and Orientation-Controlled Resistive Memory Behaviors of Carbohydrate-block-Polystyrene with Different Molecular Weights via Solvent Annealing-Reference-Cited by-同舟云学术

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Nanostructure- and Orientation-Controlled Resistive Memory Behaviors of Carbohydrate-block-Polystyrene with Different Molecular Weights via Solvent Annealing

Published:2020-04-24 Issue:20 Volume:12 Page:23217-23224
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Chuang Tsung-Han¹,Chiang Yun-Chi¹,Hsieh Hui-Ching¹,Isono Takuya²^ORCID,Huang Chao-Wei¹,Borsali Redouane³,Satoh Toshifumi²^ORCID,Chen Wen-Chang¹⁴^ORCID

Affiliation:

1. Department of Chemical Engineering, National Taiwan University, Taipei 10617, Taiwan

2. Faculty of Engineering, Hokkaido University, Sapporo 060-8628, Japan

3. Univ. Grenoble Alpes, CNRS, CERMAV, F-38000 Grenoble, France

4. Advanced Research Center for Green Materials Science and Technology, National Taiwan University, Taipei 10617, Taiwan

Funder

Hokkaido University

Ministry of Education

Japan Society for the Promotion of Science

Ministry of Science and Technology, Taiwan

Frontier Chemistry Center, Hokkaido University

Nanotech CUPAL

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.0c04551

Reference40 articles.

1. Organic Resistive Memory Devices: Performance Enhancement, Integration, and Advanced Architectures

2. Nanobatteries in redox-based resistive switches require extension of memristor theory

3. Generic Relevance of Counter Charges for Cation-Based Nanoscale Resistive Switching Memories

4. Polymer-Based Resistive Memory Materials and Devices

5. Bistable electrical switching and electronic memory effect in a solution-processable graphene oxide-donor polymer complex

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4. Interface Manipulations Using Cross-Linked Underlayers and Surface-Active Diblock Copolymers to Extend Morphological Diversity in High-χ Diblock Copolymer Thin Films;ACS Applied Materials & Interfaces;2023-05-03

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