Three-Dimensional Integration of InAs Nanowires by Template-Assisted Selective Epitaxy on Tungsten
Author:
Affiliation:
1. Department of Electrical and Information Technology, Lund University, Box 118, SE-221 00 Lund, Sweden
2. NanoLund, Lund University, Box 118, SE-221 00 Lund, Sweden
3. Solid State Physics, Lund University, Box 118, S-221 00 Lund, Sweden
Funder
Vetenskapsr?det
NanoLund, Lunds Universitet
Crafoordska Stiftelsen
Publisher
American Chemical Society (ACS)
Subject
Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.2c04908
Reference27 articles.
1. 2.5D and 3D Heterogeneous Integration: Emerging applications
2. Heterogeneous Integration of III–V Materials by Direct Wafer Bonding for High-Performance Electronics and Optoelectronics
3. Towards large size substrates for III-V co-integration made by direct wafer bonding on Si
4. Heterogeneous and Monolithic 3D Integration of III–V-Based Radio Frequency Devices on Si CMOS Circuits
5. A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Advancements and Challenges in the Integration of Indium Arsenide and Van der Waals Heterostructures;Small;2024-07-19
2. Deep-reactive ion etching of silicon nanowire arrays at cryogenic temperatures;Applied Physics Reviews;2024-04-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3