Electrochemical Grafting of an Aminated Poly(methyl methacrylate) (PMMA)-like Liner onto a Silicon Surface for the Metallization of Microfeatures
Author:
Affiliation:
1. Sheba Microsystems, 47B Coldwater Road, Toronto, OntarioM3B 1Y8, Canada
2. PCAS Canada (SEQENS), 725 rue Trotter, St-Jean-sur-Richelieu, QuebecJ3B 8J8, Canada
Publisher
American Chemical Society (ACS)
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaenm.2c00001
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1. Nanoseeding via Dual Surface Modification of Alkyl Monolayer for Site-Controlled Electroless Metallization
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3. Solvent-Dependent Adhesion Strength of Electroless Deposited Ni–P Layer on an Amino-Terminated Silane Compound-Modified Si Wafer
4. Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
5. Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro‐/Nano‐fabricated Devices
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