Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro‐/Nano‐fabricated Devices-Reference-Cited by-同舟云学术

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Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro‐/Nano‐fabricated Devices

Published:2020-10-06 Issue:2 Volume:23 Page:2000598
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Zeb Gul¹,Duong Thi Luong²,Balazinski Marek²,Le Xuan Tuan³^ORCID

Affiliation:

1. Sheba Microsystems, MaRS Centre 101 College Street Toronto ON M5G 1L7 Canada

2. Department of Mechanical Engineering Polytechnique Montréal Montréal QC H3C 3A7 Canada

3. Department of Industrialization & Chemical Processes PCAS Canada (SEQENS) 725 rue Trotter, St-Jean-sur-Richelieu Quebec J3B 8J8 Canada

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202000598

Reference30 articles.

1. Electroless Plating of Thin Gold Films Directly onto Silicon Nitride Thin Films and into Micropores

2. Dispersion stability of Si3N4 nano-particles modified by γ-methacryloxypropyl trimethoxy silane (MAPTMS) in organic solvent

3. Effects of amino groups on dispersibility of silicon nitride powder in aqueous media

4. Chapter 7. Silicon Nitride Thin Films for Nanofluidic Device Fabrication

5. Preparation and characterization of autocatalytic low phosphorus nickel coatings containing submicron silicon nitride particles

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1. The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-11

2. Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO₂ for High Aspect Ratio Through-Silicon Via Technology in 3D Integration;ACS Applied Electronic Materials;2024-03-14

3. Nano friction behaviour between magnetic materials and copper considering the inter-diffusion effect;Friction;2024-02-08

4. Structure and properties of Si ₃ N ₄ -based diamond/MoS ₂ -TiN composite films;Fullerenes, Nanotubes and Carbon Nanostructures;2024-01-23

5. Copper bonding silicon nitride substrate using atmosphere plasma spray;Journal of the European Ceramic Society;2023-08

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