Mechanism of Thermal Al2O3 Atomic Layer Etching Using Sequential Reactions with Sn(acac)2 and HF
Author:
Affiliation:
1. Department of Chemistry and Biochemistry and‡Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, United States
Funder
Division of Chemistry
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.chemmater.5b00300
Reference50 articles.
1. Plasma atomic layer etching using conventional plasma equipment
2. Molecular dynamics simulation of atomic layer etching of silicon
3. Realization of atomic layer etching of silicon
4. Atomic Layer Deposition: An Overview
5. Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges
Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Future of plasma etching for microelectronics: Challenges and opportunities;Journal of Vacuum Science & Technology B;2024-06-07
2. Surface reaction during thermal atomic layer etching of aluminum oxide films using fluorine radicals and trimethylaluminum;Applied Surface Science;2023-12
3. Isotropic plasma-thermal atomic layer etching of superconducting titanium nitride films using sequential exposures of molecular oxygen and SF6/H2 plasma;Journal of Vacuum Science & Technology A;2023-09-26
4. Comparison of BCl3, TiCl4, and SOCl2 chlorinating agents for atomic layer etching of TiO2 and ZrO2 using tungsten hexafluoride;Journal of Vacuum Science & Technology A;2023-06-20
5. Isotropic atomic layer etchings of various materials by using dry chemical removal;Japanese Journal of Applied Physics;2023-02-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3