Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging-Reference-Cited by-同舟云学术

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

Published:2021-09-23 Issue:10 Volume:3 Page:4587-4603
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Bhogaraju Sri Krishna¹^ORCID,R. Kotadia Hiren²³,Conti Fosca⁴,Mauser Armin⁵,Rubenbauer Thomas⁵,Bruetting Robert⁵,Schneider-Ramelow Martin⁶,Elger Gordon¹

Affiliation:

1. Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany

2. WMG (Warwick Manufacturing Group), The University of Warwick, Coventry CV4 7AL, United Kingdom

3. School of Engineering, Liverpool John Moores University, Liverpool L3 3AF, United Kingdom

4. Department of Chemical Sciences, University of Padova, Via Marzolo 1, 35131 Padova, Italy

5. Schlenk Metallic Pigments GmbH, Barnsdorfer Hauptstraße 5, 91154 Roth, Germany

6. Technical University of Berlin, 10623 Berlin, Germany

Funder

Bundesministerium f??r Bildung und Forschung

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.1c00721

Reference41 articles.

1. Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering

2. Die Attach Materials for High Temperature Applications: A Review

3. Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

4. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

5. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

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