Plasma Treatment Effects on Molecular Structures at Dense and Porous Low-k SiCOH Film Surfaces and Buried Interfaces
Author:
Affiliation:
1. Department of Chemistry, University of Michigan, 930 North University Avenue, Ann Arbor, Michigan 48109, United States
2. Intel Corporation, 2501 NW 229th Ave., Hillsboro, Oregon 97124, United States
Funder
Semiconductor Research Corporation
Publisher
American Chemical Society (ACS)
Subject
Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.5b06725
Reference58 articles.
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3. Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown
4. The effect of water uptake on the mechanical properties of low-k organosilicate glass
5. Integration Challenges of Nanoporous Low Dielectric Constant Materials
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