Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition

Published:2011-09-27 Issue:20 Volume:23 Page:4417-4419
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Knisley Thomas J.¹,Ariyasena Thiloka C.¹,Sajavaara Timo²,Saly Mark J.³,Winter Charles H.¹

Affiliation:

1. Department of Chemistry, Wayne State University, Detroit, Michigan 48202, United States

2. Department of Physics, University of Jyväskylä, 40014 Jyväskylä, Finland,

3. SAFC Hitech, 1429 Hilldale Avenue, Haverhill, Massachusetts 01832, United States

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm202475e

Reference29 articles.

1. The application of atomic layer deposition for metallization of 65 nm and beyond

2. International Technology Roadmap for Semiconductors,http://www.itrs.net/.

3. Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges

4. Low-Temperature Atomic Layer Deposition of Copper Metal Thin Films: Self-Limiting Surface Reaction of Copper Dimethylamino-2-propoxide with Diethylzinc

5. Investigation of AlMe3, BEt3, and ZnEt2 as Co-Reagents for Low-Temperature Copper Metal ALD/Pulsed-CVD

Cited by 70 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis, characterization, volatility, and thermal stability of fluorinated copper(II) aminoalkoxide complexes as potential vapour deposition precursors;Canadian Journal of Chemistry;2024-08-20

2. Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte;Electrochimica Acta;2024-01

3. Selective spatial atomic layer deposition of Cu, Cu2O, and CuO thin films in the open air: reality or fiction?;Materials Today Chemistry;2023-04

4. On the Mechanism of the Atomic Layer Deposition of Cu Films on Silicon Oxide Surfaces: Activation Using Atomic Hydrogen and Three-Dimensional Growth;Chemistry of Materials;2023-03-03

5. A low-temperature thermal ALD process for nickel utilizing dichlorobis(triethylphosphine)nickel(ii) and 1,4-bis(trimethylgermyl)-1,4-dihydropyrazine;Dalton Transactions;2022

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3