Thermo-Mechanical Characterization of Single-Walled Carbon Nanotube (SWCNT)-Based Through-Silicon via (TSV) in (100) Silicon-Reference-Cited by-同舟云学术

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Thermo-Mechanical Characterization of Single-Walled Carbon Nanotube (SWCNT)-Based Through-Silicon via (TSV) in (100) Silicon

Published:2015-06-01 Issue:6 Volume:7 Page:481-485
ISSN:1941-4900
Container-title:Nanoscience and Nanotechnology Letters
language:en
Short-container-title:Nanosci Nanotechnol Lett

Author:

Yin Xiangkun,Zhu Zhangming,Yang Yintang,Ding Ruixue

Publisher

American Scientific Publishers

Subject

General Materials Science

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Thermal-Stress Coupling Optimization for Coaxial through Silicon Via;Symmetry;2023-01-17

3. Investigation on impact of substrate on low-pass filter based on coaxial TSV;IEICE Electronics Express;2019

4. Mechanical Characterization and Durability Enhancement Strategies for Polyurethane/Carbon Conductive Composites;Journal of Nanoscience and Nanotechnology;2017-12-01

5. Chemical Functionalization of Inner Walls of Carbon Nanotubes with Long-Chain Aliphatic Amines;Nanoscience and Nanotechnology Letters;2017-05-01

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