Investigation on impact of substrate on low-pass filter based on coaxial TSV
Author:
Affiliation:
1. School of Automation and Information Engineering, Xi’an University of Technology
2. The Second Institute of China Aerospace Science & Industry Corp
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/16/2/16_16.20180992/_pdf
Reference13 articles.
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2. [2] F. Cervera and J. Hong: “High rejection, self-packaged low-pass filter using multilayer liquid crystal polymer technology,” IEEE Trans. Microw. Theory Techn. 63 (2015) 3920 (DOI: 10.1109/TMTT.2015.2496219).
3. [3] C. X. Zhou, et al.: “Lowpass filter with sharp roll-off and wide stopband using LTCC technology,” IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (2015) 1 (DOI: 10.1109/IMWS-AMP.2015.7325054).
4. [4] L. Qian, et al.: “Electrical modeling and analysis of a mixed carbon nanotube based differential through silicon via in 3D integration,” IEEE Trans. Nanotechnol. 15 (2016) 155 (DOI: 10.1109/TNANO.2015.2509019).
5. [5] X. Yin, et al.: “Effectiveness of p+ layer in mitigating substrate noise induced by through-silicon via for microwave applications,” IEEE Microw. Wireless Compon. Lett. 26 (2016) 687 (DOI: 10.1109/LMWC.2016.2597218).
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