An efficient thermal-stress coupling design method for coaxial through silicon via
Author:
Affiliation:
1. Xidian University,the School of Microelectronics,Xi’an,China
Funder
Ministry of Education
Innovation Fund
Fundamental Research Funds for the Central Universities
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10221568/10221569/10221635.pdf?arnumber=10221635
Reference10 articles.
1. Thermal Stress and Failure Location Analysis for Through Silicon via in 3D Integration
2. Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias
3. A precise BP neural network-based online model predictive control strategy for die forging hydraulic press machine
4. Thermo-Mechanical Characterization of Single-Walled Carbon Nanotube (SWCNT)-Based Through-Silicon via (TSV) in (100) Silicon
5. Three-Dimensional Coaxial Through-Silicon-Via (TSV) Design
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