Three-Dimensional Coaxial Through-Silicon-Via (TSV) Design
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/55/6310089/06275470.pdf?arnumber=6275470
Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array;Micromachines;2023-07-25
2. Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit;Journal of Electronic Packaging;2023-06-06
3. An efficient thermal-stress coupling design method for coaxial through silicon via;2022 10th International Symposium on Next-Generation Electronics (ISNE);2023-05-12
4. Highly Energy Efficient and Electromagnetic Interference Immuned Coaxial Through-Substrate-Vias (cx-TSVs) for Millimeter Wave Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System;Symmetry;2023-02-04
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