The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System
Author:
Wang Xianglong1ORCID, Chen Dongdong1ORCID, Li Di1ORCID, Kou Chen2, Yang Yintang1
Affiliation:
1. School of Microelectronics, Xidian University, Xi’an 710071, China 2. Business School, Xijing University, Xi’an 710123, China
Abstract
In order to meet the requirements of high performance, miniaturization, low cost, low power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With the development of 3D integrated technology, it has been used in imaging sensors, optical integrated microsystems, inertial sensor microsystems, radio-frequency microsystems, biological microsystems and logic microsystems, etc. Through silicon via (TSV) is the core technology of a 3D integrated system, which can achieve vertical interconnection between stacked chips. In this paper, the development and progress of multi-physics simulation design for TSV-based 3D integrated systems are reviewed. Firstly, the electrical simulation design of TSV in a 3D integrated system is presented, including the lumped parameters model-based design and numerical computation model-based design. Secondly, the thermal simulation design of TSV in a 3D integrated system is presented based on the analytical model or numerical computation model. Thirdly, the multi-physics co-simulation design of TSV in a 3D integrated system is presented, including the thermal stress and electron thermal coupling simulation design. Finally, this paper is concluded, and the future perspectives of 3D integrated systems are presented, including the advanced integrated microsystems, the crossed and reconfigurable architecture design technology and the standardized and intelligent design technology.
Funder
Youth Talent Fund of Joint Fund of the Ministry of Education for Equipment Pre-Research Wuhu and Xidian University special fund for industry–university research cooperation Cooperation Program of XDU-Chongqing IC Innovation Research Institute Fundamental Research Funds for the Central Universities and the Innovation Fund of Xidian University
Subject
Physics and Astronomy (miscellaneous),General Mathematics,Chemistry (miscellaneous),Computer Science (miscellaneous)
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