Innovative low temperature plasma approach for deposition of alumina films-Reference-Cited by-同舟云学术

Innovative low temperature plasma approach for deposition of alumina films

Published:2014-12 Issue:6 Volume:17 Page:1410-1419
ISSN:1516-1439
Container-title:Materials Research
language:
Short-container-title:Mat. Res.

Author:

Battaglin Felipe Augusto Darriba¹,Hosokawa Ricardo Shindi¹,Cruz Nilson Cristino da¹,Caseli Luciano²,Rangel Elidiane Cipriano¹,Silva Tiago Fiorini da³,Tabacniks Manfredo Harri³

Affiliation:

1. Universidade Estadual Paulista, Brasil

2. Universidade Federal de São Paulo, Brasil

3. Universidade de São Paulo, Brasil

Publisher

FapUNIFESP (SciELO)

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://www.scielo.br/pdf/mr/v17n6/08.pdf

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4. Ionized physical vapor deposited Al2O3 films: does subplantation favor formation of α-Al2O3?;Sarakinos K;Physica Status Solidi (RRL): Rapid Research Letters,2010

5. Alumina coatings on silica powders by fluidized bed chemical vapor deposition from aluminum acetylacetonate;Caussat B;Chemical Engineering Journal,2012

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