Effects of Sn grain structure on the electromigration of Sn–Ag solder joints-Reference-Cited by-同舟云学术

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Published:2012-02-17 Issue:8 Volume:27 Page:1131-1141
ISSN:0884-2914
Container-title:Journal of Materials Research
language:en
Short-container-title:J. Mater. Res.

Author:

Wang Yiwei,Lu Kuan H.,Gupta Vikas,Stiborek Leon,Shirley Dwayne,Chae Seung-Hyun,Im Jay,Ho Paul S.

Abstract

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference13 articles.

1. 11. Ding M. : Investigation of Electromigration Reliability of Solder Joint in Flip-Chip Packages. Ph.D. Thesis, University of Texas at Austin, 2007.

2. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin

3. Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

4. Interstitial Diffusion of Copper in Tin

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