Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints-Reference-Cited by-同舟云学术

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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Published:2011-02-11 Issue:3 Volume:26 Page:467-474
ISSN:0884-2914
Container-title:Journal of Materials Research
language:en
Short-container-title:J. Mater. Res.

Author:

Lee Kiju,Kim Keun-Soo,Tsukada Yutaka,Suganuma Katsuaki,Yamanaka Kimihiro,Kuritani Soichi,Ueshima Minoru

Abstract

Abstract

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference21 articles.

1. Pronounced electromigration of Cu in molten Sn-based solders

2. Current-crowding-induced electromigration failure in flip chip solder joints;Yeh;J. Appl. Phys.,2002

3. Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

4. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

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1. Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling;IEEE Transactions on Electron Devices;2024-01

2. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints;Materials;2022-07-21

3. Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound;Applied Surface Science;2021-04

4. Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration;Journal of Electronic Materials;2020-11-27

5. Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates;Acta Materialia;2020-08

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