Nickel silicon thin film as barrier in under-bump-metallization by magnetronsputtering deposition for Pb-free chip packaging

Abstract

In the search for a Pb-free compatible under-bump-metallization (UBM) barrier material, magnetron sputtering of a nonmagnetic nickel silicon alloy (NiSi) target was used to deposit a low-stress polycrystalline NiSi thin film. In the reaction with SnAg3.0Cu0.5 solder, NiSi was found to have greatly reduced reaction and intermetallics (IMC) formation rates compared with sputtered NiV. A continuous layer of IMCs in NiSi UBM-solder joint remains stable after 10 reflows and 1000 h thermal aging tests, resulting in preferred bulk solder failure mode in ball shearing/pull testing. Our results demonstrate that NiSi is a highly promising thin film barrier material suitable for Pb-free solder bumping.