Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), pp. 25–59.
2. J. Shen, Y.C. Chan, and S.Y. Liu, Acta Mater. 57, 5196 (2009).
3. W.K. Liou, Y.W. Yen, and C.C. Jao, J. Electron. Mater. 38, 2222 (2009).
4. S.J. Wang and C.Y. Liu, Scripta Mater. 55, 347 (2006).
5. S.-W. Chen, Y.-R. Lin, H.-J. Wu, and R.-B. Chang, J. Electron. Mater. 40, 1527 (2011).