Suppression of Stiction in MEMS-Reference-Cited by-同舟云学术

Suppression of Stiction in MEMS

Published:1999 Issue: Volume:605 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Mastrangelo C. H.

Abstract

AbstractStiction failures in microelectromechanical systems (MEMS) occur when suspended elastic members are unexpectedly pinned to their substrates. This type of device failure develops both in fabrication and during device operation, being a dominant source of yield loss in MEMS. Stiction failures require first a collapse force that brings the elastic member contact with the substrate followed by an intersolid adhesion sufficiently large to overcome the elastic restoring force. Stiction failure mechanisms have been studied extensively elsewhere [1]. This paper briefly summarizes these mechanisms in a the practical way. Over the last decade, stiction failure rates in MEMS have been minimized using a wide variety of processing, surface treatment, and physical schemes. An update of these methods is provided.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference56 articles.

1. Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory

2. Fabrication of micromechanical devices from polysilicon films with smooth surfaces

3. [4] Lysko J. M. , Stolarski E. , and Jachowicz R. S. , “Capacitive silicon pressure sensor based on the one-side wafer processing,” in Transducers' 91, pp. 685–688, 1991.

4. [2] Chau K. , Fung C. , Harris P. R. , and Dahrooge G. , “A verstile polysilicon diaphragm pressure sensor chip,” in Int. Electron Devices Meeting, (IEDM 91), pp. 695–697, 1991.

5. [13] Mastrangelo C. H. and Hsu C. H. , “A simple experimental technique for the measurement of the work of adhesion of microstructures,” in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 92), pp. 208–212, 1992.

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of an Electrostatic Actuated Dielectric Mirror With Free-Standing Layers of Polymer;IEEE Transactions on Electron Devices;2021-12

2. Cost-effective microfabrication of sub-micron-depth channels by femto-laser anti-stiction texturing;Biofabrication;2020-02-26

3. Parametrically Amplified Low-Power MEMS Capacitive Humidity Sensor;Sensors;2019-09-13

4. Electrowetting-on-dielectric actuation of a vertical translation and angular manipulation stage;Applied Physics Letters;2016-12-12

5. Experimental Investigation Into Stiction Forces and Dynamic Mechanical Anti-Stiction Solutions in Ultra-Clean Encapsulated MEMS Devices;Journal of Microelectromechanical Systems;2016-06