Optimization of III-N Based Devices Grown by RF Atomic Nitrogen Plasma Using In-Situ Cathodoluminescence

Author:

Van Hove J. M.,Chow P. P.,Klaassen J. J.,Hickman R.,Wowchak A. M.,Croswell D. R.,Polley C.

Abstract

ABSTRACTIn-situ cathodoluminescence (CL) is presented as a technique to optimize GaN, and AlGaN films deposited by MBE using an RF plasma as a source of reactive nitrogen. Excitation of the MBE grown nitride films is conveniently achieved in the preparation chamber using an Auger electron gun. The photoemission is monitored through a side port and dispersed with a 1/8 m monochromator with a typical resolution of 3 nm. The in-situ CL spectra of AlGaN and GaN films provides quick determination of both material composition, doping, and quality from the position and width of the band edge emission. The use of CL for the assessment of material composition in the growth of nitride materials is extremely beneficial since the complementary technique of RHEED oscillations is not routinely observed for these systems. The determination of material quality using CL has been used to optimize growth conditions for GaN PIN junction photovoltaic detectors on (0001) sapphire. Detectors having peak responsivity of 0.175 AAV at the GaN band edge of 365 nm and a UV to visible rejection ratio of greater than 105 have been fabricated. The high rejection ratio is accredited to the reduction of the yellow defect levels in the MBE grown material. Material optimization using in-situ CL for growth of AlGaN MODFETs having drain currents of 425 ma/mm and gm of 66 mS/mm is discussed.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Surfactant effect of In for AlGaN growth by plasma-assisted molecular beam epitaxy;Journal of Applied Physics;2003-02

2. Contact resistivity and transport mechanisms in W contacts to p- and n-GaN;Journal of Applied Physics;2000-08-15

3. W and WSix Ohmic contacts on p- and n-type GaN;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1999-07

4. GaN: Processing, defects, and devices;Journal of Applied Physics;1999-07

5. High-Density Plasma-Induced Etch Damage of GaN;MRS Proceedings;1999

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