Real-Time Plasma Process Condition Sensing and Abnormal Process Detection
Author:
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
Link
http://www.mdpi.com/1424-8220/10/6/5703/pdf
Reference27 articles.
1. The Role of RF Measurements in Plasma Etching;Almgren;Semiconduct. Int,1997
2. Endpoint Detection in Plasma Etching;Roland;J. Vac. Sci. Technol. A,1985
3. Principal Component Analysis of Optical Emission Spectroscopy and Mass Spectrometry: Application to Reactive Ion Etch Process Parameter Estimation Using Neural Networks;Shadmehr;Electrochem. Soc,1992
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