A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards-Reference-Cited by-同舟云学术

A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards

Published:2017-08-07 Issue:8 Volume:7 Page:804
ISSN:2076-3417
Container-title:Applied Sciences
language:en
Short-container-title:Applied Sciences

Author:

Kim Myunghoi,Ahn Seungyoung

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Link

http://www.mdpi.com/2076-3417/7/8/804/pdf

Reference28 articles.

1. Power Distribution Networks for System-on-Package: Status and Challenges

2. Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects;Li;IEEE Trans. Electromagn. Compat.,2010

3. Designing and Modeling for Power Integrity

4. Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

5. Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer

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