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Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

  • Published:2010-05 Issue:2 Volume:52 Page:346-356
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Wu Tzong-Lin,Chuang Hao-Hsiang,Wang Ting-Kuang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 117 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hierarchical Automatic Multilayer Power Plane Generation With Genetic Optimization and Multilayer Perceptron;Journal of Mechanical Design;2023-07-25

2. Averaged Behavior Model of Current-Mode Buck Converters for Transient Power Noise Analysis;IEEE Transactions on Electromagnetic Compatibility;2023-06

3. Fast Synthesis Method for High-Dimensional Electromagnetic Bandgap Structure Using Deep Neural Network for Power/Ground Noise Suppression;Electronics;2023-05-25

4. Enhanced Signal and Power Integrity using Novel Planar EBG design;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23

5. Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression;IEEE Transactions on Microwave Theory and Techniques;2023-04
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