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Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

  • Published:2010-05 Issue:2 Volume:52 Page:248-265
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Er-Ping Li ,Xing-Chang Wei ,Cangellaris Andreas C,En-Xiao Liu ,Yao-Jiang Zhang ,D'Amore Marcello,Joungho Kim ,Sudo Toshio

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 115 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package;IEEE Transactions on Electromagnetic Compatibility;2023-12

2. A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application;Polymers for Advanced Technologies;2023-11-23

3. Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-11

4. Pin Assignment Optimization of BGA Packages for EMI Mitigation Using Deep Reinforcement Learning;2023 International Applied Computational Electromagnetics Society Symposium (ACES-China);2023-08-15

5. Undesired-resonance Analysis and Modeling of Differential Signals Due to Narrow Ground Lines Without Stitching Vias;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
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