Affiliation:
1. Department of Nephrology Xi'an People's Hospital Xi'an P.R. China
2. Queen Mary University of London Engineering School, Northwestern Polytechnical University Xi'an P.R. China
3. Shandong College of Tourism and Hospitality Jinan P.R. China
4. Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering Northwestern Polytechnical University Xi'an P.R. China
Abstract
AbstractEpoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant (ε) and dielectric loss (tanδ) of common epoxy resins are relatively high (ε for 3.8–4.2; tanδ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tanδ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tanδ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.