Effects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wires with Various Pd and Au Contents-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wires with Various Pd and Au Contents

Published:2016-08-04 Issue:8 Volume:6 Page:182
ISSN:2075-4701
Container-title:Metals
language:en
Short-container-title:Metals

Author:

Chuang Chien-Hsun,Tsai Chih-Hsin,Lin Yan-Cheng,Lin Hsin-Jung

Funder

Ministry of Economic Affairs

Ministry of Science and Technology

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Link

http://www.mdpi.com/2075-4701/6/8/182/pdf

Reference24 articles.

1. Phase transformations in thermally exposed Au-Al ball bonds

2. Formation and Growth of Intermetallics in an Annealing-Twinned Ag-8Au-3Pd Wire Bonding Package During Reliability Tests

3. Copper Wire Bonding Concerns and Best Practices

4. Thermal stability of grain structure and material properties in an annealing-twinned Ag–8Au–3Pd alloy wire

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Eti Gümüş Maden İşletmeleri Atık Barajlarındaki Gümüşün Geri Kazanımı;European Journal of Science and Technology;2021-01-07

2. The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N₂-Free Conditions;MATERIALS TRANSACTIONS;2018-09-01

3. Extraction of gold and silver in the selective chlorination roasting process of cyanidation tailing;Separation Science and Technology;2017-11-30

4. A study on electromigration-inducing intergranular fracture of fine silver alloy wires;Applied Physics Letters;2017-01-16

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3