A study on electromigration-inducing intergranular fracture of fine silver alloy wires
Author:
Affiliation:
1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4974154
Reference22 articles.
1. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
2. Critical study of thermosonic copper ball bonding
3. What is the future of bonding wire? Will copper entirely replace gold?
4. Study of factors affecting the hardness of ball bonds in copper wire bonding
5. Electromigration and void observation in silver
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