Author:
Srikanth N.,Murali S.,Wong Y.M.,Vath Charles J.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield;Harman,1997
2. Study on thermosonic ball bonding of copper and gold wires;Murali,2002
3. An analysis of intermetallics formation of gold and copper ball bonding on thermal aging
4. EIA/JESD22-B116, Wire bond shear test method, EIA/Jedec Standard, Electronic Industries Alliance, Arlington, USA, 1998.
5. Melting and solidification of thin wires: a class of phase change problems with a mobile interface—II. Experimental confirmation;Cohen;Int. J. Heat Mass Trans.,1995
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