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Melting and solidification of thin wires: a class of phase-change problems with a mobile interface—II. Experimental confirmation

  • Published:1995-06 Issue:9 Volume:38 Page:1647-1659
  • ISSN:0017-9310
  • Container-title:International Journal of Heat and Mass Transfer
  • language:en
  • Short-container-title:International Journal of Heat and Mass Transfer

Author:

Cohen I.M.,Huang L.J.,Ayyaswamy P.S.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference5 articles.

1. An experimental study of ball formation processes with aluminum and copper;Cohen;Expl Thermal Fluid Sci.,1989

2. Ball formation in wire bonding—I. Upscaled experimental study;Huang;Int. J. Hybrid Microelectron.,1990

3. Ball formation processes in aluminum bonding wire;Cohen;Solid State Technol.,1985

4. Melting and solidification of thin wires: a class of phase-change problems with a mobile interface—I. Analysis;Huang;Int. J. Heat Mass Transfer,1995

5. An analysis of solidification of metals and alloys accompanied by density change and void formation;Huang;ASME J. Electron. Packaging,1989

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1. Mechanical and Electrical Properties of Palladium-Coated Copper Wires with Flash Gold;Journal of Electronic Materials;2017-03-07

2. Numerical study of melting a rod by a periodically moving local heat source;International Journal of Thermal Sciences;2015-11

3. Dynamics of solid-melt front migration from a reaction–diffusion model;Heat and Mass Transfer;2013-08-28

4. Defect detection in wire welded joints using thermography investigations;Materials Science and Engineering: B;2012-09

5. Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-08
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