Author:
Chang Chia-Yun,Hung Fei-Yi,Lui Truan-Sheng
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. G.G. Harman, Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield, 2nd ed. (New York: McGraw-Hill, 1997), p. 1.
2. L.T. Nguyen, D. McDonald, A.R. Danker, and P. Ng, IEEE Trans. Compon. Packag. Manuf. Technol. Part A 18, 423 (1995).
3. S. Kaimor, T. Nonaka, and A. Mizoguchi, IEEE Trans. Adv. Packag. 29, 227 (2006).
4. J. Kam, H. Meng, D. Stephan, D. Calipito, K. Dittmer, and L. Jamin, in Proceedings of the SEMICON Singapore (2007), p. 49.
5. N. Srikanth, S. Murali, Y.W. Wong, and C.J. Vath III, Thin Solid Films 462, 339 (2004).
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