The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N<sub>2</sub>-Free Conditions-Reference-Cited by-同舟云学术

The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N₂-Free Conditions

Published:2018-09-01 Issue:9 Volume:59 Page:1487-1492
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Kim Gun Rae¹²,Ha Sang-Su¹,Park Cheol-Hyeon¹,Pae Sangwoo¹,Choi Byoungdeog²

Affiliation:

1. Technology Quality and Reliability, Quality and Reliability Team, Foundry Business, Samsung Electronics Co., Ltd.

2. School of Information and Communication Engineering, Sungkyunkwan University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/59/9/59_MG201803/_pdf

Reference14 articles.

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2. 2) C. Oijia, P. Ariel, R. Dexter, T. Sven and J.T. Howell: Proceedings of the 12th Electronics Packaging and Technology Conference, (2010) pp. 591–596.

3. 3) C. Hang, C. Wang, M. Shi, X. Wu and H. Wang: Proceedings of the 6th International Conference on Electronic Packaging Technology, (2005) pp. 414–418.

4. 4) Y.H. Lu, Y.W. Wang, B.K. Appelt, Y.S. Lai and C.R. Kao: Electronic Components and Technology Conference, (2011) pp. 1481–1488.

5. 5) J.S. Cho, H.S. Jeong, J.T. Moon, S.J. Yoo, J.S. Seo, S.M. Lee, S.W. Ha, E.K. Her, S.H. Kang and K.H. Oh: Electronic Components and Technology Conference, (2009) pp. 1569–1573.

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