Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy-Reference-Cited by-同舟云学术

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Published:2023-09-11 Issue: Volume: Page:
ISSN:
Container-title:ICAME 2023
language:
Short-container-title:

Author:

Hameed Muhammad Sohail¹,Wakeel Aneela¹,Pasha Riffat Asim¹,Ullah Barkat²^ORCID,Ali Umair³

Affiliation:

1. Department of Mechanical Engineering, Faculty of Mechanical & Aeronautical Engineering, University of Engineering and Technology, Taxila 74050, Pakistan

2. Department of Mechanical Engineering, COMSATS University Islamabad, Wah Campus, Wah Cantt 47040, Pakistan

3. Department of Mechanical Engineering, CECOS University of Information Technology and Emerging Sciences, Peshawar 25000, Pakistan

Publisher

MDPI

Link

https://www.mdpi.com/2673-4591/45/1/18/pdf

Reference11 articles.

1. A critical review on performance, microstructure and corrosion resistance of Pb-free solders;Fazal;Meas. J. Int. Meas. Confed.,2019

2. A review: Microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics;Aamir;Solder. Surf. Mt. Technol.,2020

3. Sun, L., and Zhang, L. (2015). Review Article: Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder. Adv. Mater. Sci. Eng., 2015.

4. Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions;Hammad;Mater. Des.,2013

5. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy;Metals;2023-10-27