Temperature Dependence of Total Ionizing Dose Effects of β-Ga2O3 Schottky Barrier Diodes

Author:

Fu Weili12,Ma Teng1,Lei Zhifeng1,Peng Chao1,Zhang Hong1,Zhang Zhangang1,Xiao Tao12,Song Hongjia2,Wang Yuangang3,Wang Jinbin2,Fu Zhao2,Zhong Xiangli2

Affiliation:

1. Reliability Physics and Application Technology of Electronic Component Key Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China

2. National-Provincial Laboratory of Special Function Thin Film Materials, School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105, China

3. The National Key Laboratory of Solid-State Microwave Devices and Circuits, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China

Abstract

This paper investigates the temperature-dependent effects of gamma-ray irradiation on β-Ga2O3 vertical Schottky barrier diodes (SBDs) under a 100 V reverse bias condition at a total dose of 1 Mrad(Si). As the irradiation dose increased, the radiation damage became more severe. The total ionizing dose (TID) degradation behavior and mechanisms were evaluated through DC, capacitance–voltage (C-V), and low-frequency noise (LFN) measurements by varying irradiation, and the test results indicated that TID effects introduced interface defects and altered the carrier concentration within the material. The impact of TID effects was more pronounced at lower temperatures compared to higher temperatures. Additionally, the annealing effect in the high-temperature experimental conditions ameliorated the growth of interface trap defects caused by irradiation. These results suggest that compared to low-temperature testing, the device exhibits higher TID tolerance after high-temperature exposure, providing valuable insights for in-depth radiation reliability studies on subsequent related devices.

Funder

National Natural Science Foundation of China

GuangDong Basic and Applied Basic Research Foundation

Innovation Center of Radiation Application

Publisher

MDPI AG

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