Author:
Tang Haochun,Chang Tso-Fu Mark,Chai Yaw-Wang,Chen Chun-Yi,Nagoshi Takashi,Yamane Daisuke,Ito Hiroyuki,Machida Katsuyuki,Masu Kazuya,Sone Masato
Abstract
Hierarchical structures of 20 nm grains embedded with twins are realized in electrodeposited Au–Cu alloys. The electrodeposition method allows refinement of the average grain size to 20 nm order, and the alloying stabilizes the nanoscale grain structure. Au–Cu alloys are face-centered cubic (FCC) metals with low stacking fault energy that favors formation of growth twins. Due to the hierarchical structure, the Hall–Petch relationship is still observed when the crystalline size (average twin space) is refined to sub 10 nm region. The yield strength reaches 1.50 GPa in an electrodeposited Au–Cu alloy composed of 16.6 ± 1.1 nm grains and the average twin spacing at 4.7 nm.
Funder
Japan Science and Technology Agency
Japan Society for the Promotion of Science
Subject
General Materials Science,Metals and Alloys