1. Microelectronic Packaging, M. Datta, T. Osaka and J.W. Schultze Editors, CRC Press, Boca Raton, 2005
2. R. Holliday and P. Goodman,IEE Review, 2002,48 (3), 15
3. I. R. Christie and B.P Cameron,Gold Bull., 1994,27, 12
4. J. Traut, J. Wright and J. Williams,Plat. Surf. Fin., 1990,77, 49
5. J. Jasper and D. Shiels,European Semiconductor, 2000,22, 86