Examination of Bulge Test for Determining Residual Stress, Young’s Modulus, and Poisson’s Ratio of 3C-SiC Thin Films

Author:

Mitchell Jay S.1,Zorman Christian A.2,Kicher Thomas3,Roy Shuvo4,Mehregany Mehran5

Affiliation:

1. PhD Precandidate, Dept. of Mechanical Engineering, Univ. of Michigan, 2250 G.G. Brown, 2350 Hayward, Ann Arbor, MI 48109-2125.

2. Dept. of Electrical Engineering and Computer Science, Case Western Reserve Univ., 10900 Euclid Ave., Cleveland, OH 44106.

3. Dept. of Mechanical Engineering, Univ. of Michigan, 2250 G.G. Brown, 2350 Hayward, Ann Arbor, MI 48109-2125.

4. Dept. of Electrical Engineering and Computer Science, Case Western Reserve Univ., 10900 Euclid Ave., Cleveland OH 44106. Current address: Dept. of Biomedical Engineering, The Cleveland Clinic Foundation, Cleveland OH 44195.

5. BFGoodrich Professor of Engineering Innovation, Dept. of Electrical Engineering and Computer Science, Bingham Bldg, Room 118, Case Western Reserve Univ., 10900 Euclid Avenue, Cleveland, OH 44106 (corresponding author).

Publisher

American Society of Civil Engineers (ASCE)

Subject

Mechanical Engineering,Aerospace Engineering,General Materials Science,Civil and Structural Engineering

Reference24 articles.

1. Microfabricated structures for theinsitumeasurement of residual stress, Young’s modulus, and ultimate strain of thin films

2. Beams J. W. (1959). “Mechanical properties of thin films of gold and silver.” Structure and properties of thin films Wiley New York 183–192.

3. Berg J. von Reichert W. Obermeier E. Wagner C. Krotz Diamler G. and Niemann E. (1996). “Dependence of the elastic properties of thin β-SiC films on their crystallinity and the deposition conditions.” Transactions of the 3rd Int. HiTEC Alburquerque N.M. 51–57.

4. Error limitations in the determination of mechanical properties of thin films.;Breton F. A.;J. Reinf. Plast. Compos.,1997

5. Fracture strength and biaxial modulus measurement of plasma silicon nitride films

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