Membrane‐based mechanical characterization of screen‐printed inks: Deflection analysis of ink layers on polyimide membranes

Author:

Masarweh Eléonore1ORCID,Arseenko Mariia2,Guaino Philippe2,Flandre Denis1

Affiliation:

1. ELEN, ICTeam UCLouvain Louvain‐la‐Neuve Belgium

2. Advanced & Smart Surface Solutions CRM Group Liège Belgium

Abstract

AbstractMeasurements of Young's modulus and residual stresses of screen‐printed ink layers using a bulge test on coated polyimide‐based membranes are proposed in this work. The applied bulge test monitors the deflection of membranes under pressure with interferometry. The obtained Young's modulus ranges from 6 to 8 GPa for a carbon blend‐based ink and is around 12 GPa for a silver nanoparticle ink. These values are compared with standard nanoindentation and show good agreement. Besides, the residual stresses range from −4 to 8 MPa for the carbon blend‐based ink, while the silver ink is measured around −10 MPa. The use of the membrane‐based method underlines the influence of exact deposition and curing conditions on the ink film material properties. The impact of the substrate on the ink layer properties, such as the thickness and its uniformity, is discussed, especially with regard to the heat treatment of the membrane.

Publisher

Wiley

Reference34 articles.

1. The effect of the ink composition on the performance of carbon-based conductive screen printing inks

2. Adhesion of Screen-Printed Silver Metallization to Crystalline Silicon Solar Cells

3. R.Lakhmi H.Debeda I.Dufour C.Lucat 20th Workshop Micromachining Micro Mech. Micro Syst. (MME'09) Toulouse France 2009.

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